DayOne Data Centers in early talks for a potential $500 million bond

DayOne Data Centers explores $500 million bond to fund expansion

Expansion Efforts

DayOne Data Centers is in early talks with banks about a potential $500 million bond offering to support its expansion efforts. The company is already juggling an IPO filing, a giant loan package, and a fresh Series C round, and the bond issuance could be finalized as early as 2027.

Debt Effort

The bond conversations sit alongside a much larger debt effort. DayOne has closed half of an approximately $7 billion-equivalent loan package, described as one of Asia's largest AI-linked borrowings.

Background

DayOne is the former international arm of GDS Holdings. The spinoff was completed in January 2025, separating the overseas business from its former parent. Since then, DayOne has focused on hyperscale, AI-optimized facilities. These are very large campuses built for big cloud and technology customers that need significant computing capacity on long-term contracts.

Financials

On October 5, 2026, DayOne filed for a US IPO aiming to raise as much as $5 billion by listing American depositary shares on Nasdaq under the ticker DODC. That listing follows a $4.5 billion Series C funding round the company closed in June 2026.

Revenue and Loss

In the first half of 2026, the company reported revenue of $512 million, up from $151.5 million in the same period a year earlier. DayOne's net loss widened to $77.2 million, compared with a $12.6 million loss a year before.